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Solutions - Products

VULCAN™ High-K & Dielectrics
VULCAN™ Metals
VULCAN™ Metal ALD/CVD

VULCAN™ Metal ALD/CVD Overview

VESTA Technology introduced next generation Nano-ALD system for metal barrier and capacitor electrode processes of nano generation semiconductor devices. Our VULCAN™ Metal ALD/CVD systems use both CVD (Chemical Vapor Deposition) and the ALD (Atomic Layer Deposition) technology to provide solution for the precise control of thin film thickness, high quality thin film, particle generation and step coverage.

VULCAN™ Metal ALD/CVD Features

- Single-wafer, multi-chamber cluster tool(up to 4 chambers)
- Configurable bridge tool for 200 to 300mm wafer processing
- Dual ALD and CVD process capability
- Advanced low temp. process feature
- In-situ and sequential process capability
- Compact and optimum chamber design
- Precisely controlled chamber components
- Modular design for easy maintenance and service
- High speed capability with centralized pumping
- Minimized gas feeding block
- Anti-corrosion materials coated Chamber
- Software programmable ALD/CVD plasma process


VULCAN™ Metal ALD/CVD Application

- Barrier Metal and Adhesion Layer
- Capacitor electrode
- Gate electrode
- Seed Layer

 
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